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TPCA show, Taipei, Taiwan - October 20-22, 2010


News
August 14, 2009 -  Frontline announces the release of InPlan™ 2.70

Frontline PCB Solutions announces the release of version 2.70 of its InPlan™ engineering system.

InPlanTM 2.70 offers improved traveler editing through adding groups of MRP steps, significant forms customization improvements including field and column width setting.  More features are available for stackup and InPlan™ Flex.

In a significant step for InPlanTM, its Impedance Coupon Generator (ICG) module, version 2.70 provides coupon editing tools to further customize text labels and reduce the coupon size. Other features enable minimizing the coupon footprint on the panel and ensuring accurate testing.

InPlanTM 2.7 is a major new version featuring significant improvement to open job performance, as well as new and improved tools for reducing database size through deleting unwanted items and purging unneeded revisions of jobs, materials and rules.

InPlanTM 2.7 is a licensed version and is available for all customers with a valid service contract.

See the Support Latest Version section for a complete list of new features and enhancements.